Development of the Advanced Memory Micromodule with Extended Radiation Resistance

Abstract

The article presents the advanced memory micromodule made by the new 3D integration technology. The technology gives the opportunity to improve size and electrical characteristics of a wide range of the devices. The example of the memory micromodule with extended radiation resistance shows the advantages of the new technology. The main advantage of the new technology allows to unite PCBs with electronic components in stacks, thereby reducing the module mount area in times in comparison with standard planar technology. The memory micromodule includes radiation tolerant electronic components, developed and manufactured in SMC “Technological centre”.